| OIF To Address 100G Long-Haul DWDM Market Needs |
|
|
|
| Wednesday, 11 June 2008 19:04 |
|
The Optical Internetworking Forum's Physical and Link Layer Working Group (PLL WG) designated a new work project to address 100G long-haul DWDM. This project will foster the development of an ecosystem where service providers, data and optical networking equipment vendors, optical module and subsystem vendors, and underlying component providers will work together to accelerate the availability of high performance, cost-effective long distance transmission solutions for 100G.
The Optical Internetworking Forum's Physical and Link Layer Working Group (PLL WG) designated a new work project to address 100G long-haul DWDM. This project will foster the development of an ecosystem where service providers, data and optical networking equipment vendors, optical module and subsystem vendors, and underlying component providers will work together to accelerate the availability of high performance, cost-effective long distance transmission solutions for 100G. The 100G long-haul project will result in a DWDM transmission implementation agreement (IA) focused on a specific modulation format and receiver approach. It will seek to reach agreement on a Forward Error Correction (FEC) algorithm suitable for the long-haul 100G application. This implementation agreement will complement and build upon the work already underway defining 100 G Ethernet in the IEEE, and the new 100G level of the Optical Transport Hierarchy (OTH) in the ITU-T. "With network element vendors already in development for 100G, we will select an implementation approach supported by a critical mass within the industry," said David Stauffer, of IBM and the OIF's PLL WG chair. "We see an immediate need to focus on a solution for long-distance DWDM." Additionally, while at the Forum's quarterly meeting this month, members of the PLL WG adopted baseline requirements for an electrical specification for 25 Gbps backplane (long reach) interfaces. This follows the prior adoption by the WG of baseline requirements for an electrical specification for 28 Gbps chip-to-chip and chip-to-module (short reach) interfaces. These electrical specifications will be added as additional clauses in the next generation of the Common Electrical I/O (CEI) implementation agreement. Members of the OIF also participated in a workshop hosted at Telecom Italia Labs. This workshop was the second of a series of workshops on Packet Transport Technology - "Focus on T-MPLS." This workshop provided attendees an introduction to T-MPLS networks, their evolution, the enabling standards, and examples of their application in multi-service, converged networks for business and residential services. Presentations from the workshop are available to the public at http://www.oiforum.com/public/meetOIW050508.html New Software Working Group Chair SOURCE: The Optical Internetworking Forum |
Transceiver
- 10G SFP+, CWDM/DWDM SFP+, BiDi SFP+
- 10G XFP, DWDM XFP, CWDM XFP, BiDi XFP
- 10G X2, DWDM X2, CWDM X2, BiDi X2
- DWDM SFP
- CWDM SFP
- BiDi SFP
- SFP
- GPON OLT ONU SFP SFF
- GEPON OLT ONU SFP SFF
- SGMI SFP, BiDi SGMI SFP
- HD SDI digital video SMPTE SFP
- Copper SFP/GBIC
- CWDM passive system
- DWDM passive system
- SFP+ XFP 10G testing solution
- Customized Transceivers
- CFP 40G module
- CSFP transceiver
- CPRI OBSAI LTE SFP
- SFF
- BiDi SFF
- CWDM SFF
- GBIC
- BiDi GBIC
- CWDM GBIC
- 1x9, BiDi 1x9, CWDM 1x9 Module
- Triplexer
- BOSA
- TOSA
- ROSA
- 1x5 Module


